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Circuits, Interconnections, and Packaging for Vlsi. H. B. Bakoglu
Circuits.Interconnections.and.Packaging.for.Vlsi.pdf
ISBN: 0201060086,9780201060089 | 540 pages | 14 Mb
Circuits, Interconnections, and Packaging for Vlsi H. B. Bakoglu
Publisher: Addison Wesley Longman Publishing Co
AbeBooks.com: Circuits, Interconnections, and Packaging for Vlsi ( 9780201060089) by Bakoglu, H.B. Get new, rare & used books at our marketplace. Bakoglu, Circuits, Interconnections and Packaging for VLSI, Addison- Wesley, Reading, MA, 19902. Language: English Released: 1990. 0201060086 Visible shelf wear -- may have some notes/markings on pages Hardcover Addison-Wesley Pub (Sd) 0201060086. Download free Circuits, Interconnections, and Packaging for Vlsi - H. Fundamentals of Modern VLSI Devices ($7.68) A Design Manual for Implementation of Projects on F • Circuits, Interconnections, and Packaging for Vlsi . Circuits, Interconnections, and Packaging for Vlsi (Addison-Wesley VLSI systems series) [H. Circuits interconnections and packaging for vlsi download on GoBookee.net free books and manuals search - Introduction to VLSI Interconnect Design 1- print. Publisher, Addison-Wesley Pub (Sd). Bakoglu, “Circuits interconnects and packaging for VLSI ” , Addison Wesley; W. Interconnects and Packaging tures for microelectronic integrated circuits, a subject which is useful simulation environmeiit for design automation for VLSI. Bakoglu, Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, Chapter 9, 1990. Bakoglu, Circuits, Interconnections and Packaging for VLSI. Circuits, interconnections, and packaging for VLSI by H B Bakoglu - Find this book online from $17.46. Results 1 - 10 of 278 CiteSeerX - Scientific documents that cite the following paper: Circuits, interconnections and packaging for VLSI. GO Circuits, Interconnections, and Packaging for Vlsi Author: H. Reading, MA: Addison-Wesley, 1990. Publisher: Addison Wesley Longman Publishing Co Page Count: 540. It is the packaging interconnection that ultimately influences the signal integrity of “Circuits Interconnects, and Packaging for VLSI”, H.
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